Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Nien-Fang Wu0
Tzuan-Horng Liu0
Chao-Wen Shih0
Ming-Fa Chen0
Sung-Feng Yeh0
Date of Patent
July 6, 2021
0Patent Application Number
166581310
Date Filed
October 20, 2019
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Semiconductor packages and method of forming the same are disclosed. One of the semiconductor packages includes a first die, a second die, a through via and a dielectric encapsulation. The second die is bonded to the first die. The through via is disposed aside the second die and electrically connected to the first die. The through via includes a step-shaped sidewall. The dielectric encapsulation encapsulates the second die and the through via.
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