US Patent 11063169 Substrate structuring methods
Patent 11063169 was granted and assigned to Applied Materials on July, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
November 18, 2019
Date of Patent
July 13, 2021
Patent Applicant
Patent Application Number
16687564
Patent Citations
•••
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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