Patent attributes
Disclosed is a semi-rigid enrolment case for a smart card, formed by folding and gluing an envelope-like cardboard blank of the dimensions of the card. The case includes an electrical circuit printed directly on the cardboard of an inner surface. The circuit includes contact studs connected to a power supply interface and arranged to connect electrical contacts of the card to the power supply interface when the card is inserted into the case. A biometric sensor of the card remains accessible to the user when it is out of the case for making the enrolment. Through-openings are made in the cardboard on either side of contact stud lines and allow forming independent flexible areas, providing better contact between the studs and the electrical contacts of the card.
