US Patent 11069568 Ultra-thin diffusion barriers
Patent 11069568 was granted and assigned to Applied Materials on July, 2021 by the United States Patent and Trademark Office.
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Patent abstract
In one embodiment, a method of forming a barrier layer is provided. The method includes positioning a substrate in a processing chamber, forming a barrier layer over the substrate and in contact with the underlayer, and annealing the substrate. The substrate comprises at least one underlayer having cobalt, tungsten, or copper. The barrier layer has a thickness of less than 70 angstroms.
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Current Assignee
Patent Jurisdiction
Patent Number
110695680
Date of Patent
July 20, 2021
0Patent Application Number
168032110
Date Filed
February 27, 2020
0Official Website
Patent Citations
Patent Primary Examiner
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
110695680
Date of Patent
July 20, 2021
0Patent Application Number
168032110
Date Filed
February 27, 2020
0Official Website
Patent Citations
Patent Primary Examiner
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US Patent 11069568 Ultra-thin diffusion barriers
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11069568
Date of patent
July 20, 2021
Patent application number
16803211
Date Filed
February 27, 2020
Patent citations
Patent primary examiner
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