Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yuan-Hung Hsu0
Chee-Key Chung0
Wei-Jhen Chen0
Yu-Lung Huang0
Chang-Fu Lin0
Date of Patent
July 20, 2021
0Patent Application Number
169090430
Date Filed
June 23, 2020
0Patent Citations
Patent Primary Examiner
Patent abstract
An electronic package is formed by arranging two encapsulating portions of different materials between a plurality of electronic components stacked to each other to adjust a stress distribution of the electronic package, so that the degree of warpage of the electronic package can be optimally controlled.
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