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US Patent 11072027 Removable 3D build module comprising a memory

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Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Pol Morral0

Esteve Comas0

Fernando Juan0

Jordi Gimenez Manent0

Pablo Dominguez Pastor0

Pau Martin Vidal0

Date of Patent

July 27, 2021

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Patent Application Number

155420520

Date Filed

January 20, 2015

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Patent Citations Received

US Patent 11498266 Three-dimensional molding device and method for molding three-dimensional molded object

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US Patent 12076918 Additive manufacturing apparatuses and methods for using the same

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US Patent 12118627 Secure and traceable manufactured parts

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Patent Primary Examiner

Joseph S Del Sole

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Patent abstract

A removable build module to connect to a host apparatus, may include a build platform to support an object-to-be-built, a drive unit to move the build platform, a memory to receive and store build parameters, and an interface circuit to communicate the build parameters to the host apparatus.

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