Patent attributes
An LED filament includes LED chips, two conductive electrodes, light conversion coating, and attaching structure. The LED chips are electrically connected with one another. Each of the two conductive electrodes is electrically connected to a corresponding LED chip of the LED chips. The light conversion coating is coated on two sides of the LED chips and the two conductive electrodes. A portion of each of the two conductive electrodes is exposed from the light conversion coating. The light conversion coating includes a top layer and a base layer. The base layer coats on one side of the LED chips, and the top layer coats on another sides of the LED chips. The attaching structure is between the top layer and the base layer, between the base layer and the conductive electrodes, or between the top layer and the conductive electrodes.
