A semiconductor memory apparatus includes a plurality of memory dies and a logic die, which are stacked to each other. The logic die includes a memory interface for a memory apparatus to be coupled to the semiconductor memory apparatus, and a switch coupled to a plurality of channels included in a control device which controls the semiconductor memory apparatus. The switch includes a first switch element which couples one of the plurality of channels to the memory interface or one of the plurality of memory dies, and a second switch element which couples another one of the plurality of channels to another one of the plurality of memory dies. Even if some memory dies are defective, the semiconductor memory apparatus is capable to operate.