A high speed wire end connector includes a printed circuit board, a cable, an inner film, an outer casing, and a molded bonding layer. The cable is soldered to the printed circuit board, the inner film covers a part of the cable and a part of the printed circuit board, and the outer casing is used to fix the printed circuit board, the cable and the printed circuit board, and a part of the printed circuit board is passed through a guide hole of the outer casing. The molded bonding layer bonds the outer casing to the inner film. In addition, a metal spring latch is mounted on the outer casing.