US Patent 11078117 Thermally-conductive, low strength backfill material
Patent 11078117 was granted and assigned to Nano and Advanced Materials Institute on August, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 25, 2020
Date of Patent
August 3, 2021
Patent Applicant
Patent Application Number
20200225
Patent Jurisdiction
Patent Number
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