US Patent 11088016 Method for locating devices

The disclosure relates to a process for locating devices, the process comprising the following steps:a) providing a carrier substrate comprising:a device layer; andalignment marks;b) providing a donor substrate;c) forming a weak zone in the donor substrate, the weak zone delimiting a useful layer;d) assembling the donor substrate and the carrier substrate; ande) fracturing the donor substrate in the weak zone so as to transfer the useful layer to the device layer;wherein the alignment marks are placed in cavities formed in the device layer, the cavities having an aperture flush with the free surface of the device layer.