Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kuo-Chun Hsieh0
Date of Patent
August 17, 2021
0Patent Application Number
201901180
Date Filed
January 18, 2019
0Patent Citations Received
Patent abstract
A heat dissipation device includes a main body and at least one heat conduction member. The main body has a top face. A periphery of the top face has a connection section. One end of the heat conduction member is correspondingly in contact and connection with the top face or the connection section. By means of the structure design of the present invention, the horizontal heat dissipation effect is greatly enhanced and the heat dissipation effect of the entire heat dissipation device is greatly enhanced.
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