Patent attributes
A package structure and a method of manufacturing the same are provided. The package structure includes a substrate, a redistribution layer (RDL) structure, a first die, an encapsulant and a plurality of conductive terminals. The RDL structure is disposed on and electrically connected to the substrate. A width of the RDL structure is less than a width of the substrate. The first die is disposed on the substrate and the RDL structure. The first connectors of the first die are electrically connected to the RDL structure. The second connectors of the first die are electrically connected to the substrate. A first pitch of two adjacent first connectors is less than a second pitch of two adjacent second connectors. The encapsulant is on the substrate to encapsulate the RDL structure and the first die. The conductive terminals are electrically connected to the first die through the substrate and the RDL structure.
