Patent attributes
An electrical component configured to reduce a decrease in lifetime of a solder bonding portion of a lead terminal, and a method for manufacturing the electrical component are provided. The electrical component includes a unit, a housing case, and a sealing member. The unit includes a circuit board, a cover member covering the circuit board, and a lead terminal integrated with the cover member and soldered to the circuit board. The housing case houses the unit. The sealing member is disposed between the cover member and the housing case. The method for manufacturing the electrical component includes positioning the unit with respect to the housing case while disposing a liquid sealing member as a precursor of the sealing member between the cover member and the housing case, and hardening the liquid sealing member after the positioning.
