US Patent 11101784 Electrical component with heat dissipation
Patent 11101784 was granted and assigned to SnapTrack on August, 2021 by the United States Patent and Trademark Office.
All edits
Edits on 12 Dec, 2023
Golden AI
Edits made to:
Article (+347 characters)
Article
Patent abstract
In order to improve heat dissipation from electrical components with heat-generating component structures, it is proposed to provide a radiation layer with a large surface in the area of the component structures. Preferably, the radiation layer is very heat-conductive or in heat-conductive connection with the component structures.
Edits on 23 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 31 Mar, 2023
Golden AI
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111017840
Date of Patent
August 24, 2021
0Patent Application Number
201611070
Date Filed
November 7, 2016
0Official Website
Edits on 22 Sep, 2022
Golden AI
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111017840
Date of Patent
August 24, 2021
0Patent Application Number
201611070
Date Filed
November 7, 2016
0Official Website
Edits on 6 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 5 Oct, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 11101784 Electrical component with heat dissipation
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11101784
Date of patent
August 24, 2021
Patent application number
20161107
Date Filed
November 7, 2016
Find more entities like US Patent 11101784 Electrical component with heat dissipation
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
