US Patent 11114341 Laser processing method
Patent 11114341 was granted and assigned to Disco Corporation on September, 2021 by the United States Patent and Trademark Office.
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A laser processing method for a substrate with a device formed on a front surface thereof and including an electrode pad, the method including: a laser beam applying step of applying the laser beam to the back surface of the substrate to form a fine hole in the substrate at a position corresponding to the electrode pad; a detecting step of detecting first plasma light emitted from the substrate at the same time that the fine hole is formed in the substrate by the laser beam applied thereto, and second plasma light emitted from the electrode pad; and a laser beam irradiation finishing step of stopping application of the laser beam when the second plasma light is detected in the detecting step. A peak power density of the laser beam to be applied is set in a range from 175 GW/cm2 or less to 100 GW/cm2 or more.
US Patent 11114341 Laser processing method
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