Patent attributes
A wafer processing method is a method of dividing a wafer in which a functional layer is laminated to a top surface of a substrate and a plurality of devices are formed, along streets dividing the plurality of devices. The wafer processing method includes: a protective member disposing step of disposing an adhesive tape on the functional layer side of a top surface of the wafer; a cutting step of forming, along the streets, a cut groove having a depth exceeding a finished thickness of the wafer by making a cutting blade cut into an undersurface of the wafer; and a plasma etching step of extending the cut groove toward the top surface of the wafer and dividing the substrate along the streets by plasma-etching, from an undersurface side, the wafer whose adhesive tape side is held by a chuck table.
