Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chih-Chien Pan0
Chin-Fu Kao0
Li-Hui Cheng0
Szu-Wei Lu0
Date of Patent
September 14, 2021
0Patent Application Number
201910160
Date Filed
October 16, 2019
0Patent Citations Received
Patent abstract
Semiconductor packages and methods of forming the same are disclosed. a semiconductor package includes a die and an underfill. The die is disposed over a surface and includes a first sidewall. The underfill encapsulates the die. The underfill includes a first underfill fillet on the first sidewall, and in a cross-sectional view, a second sidewall of the first underfill fillet has a turning point.
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