US Patent 11145598 Lattice bump interconnect
Patent 11145598 was granted and assigned to Texas Instruments on October, 2021 by the United States Patent and Trademark Office.
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Patent abstract
An interconnect structure for a semiconductor device includes a plurality of unit cells. Each unit cell is formed of interconnected conducting segments. The plurality of unit cells forms a conducting lattice.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111455980
Date of Patent
October 12, 2021
0Patent Application Number
201812280
Date Filed
December 28, 2018
0Official Website
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111455980
Date of Patent
October 12, 2021
0Patent Application Number
201812280
Date Filed
December 28, 2018
0Official Website
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US Patent 11145598 Lattice bump interconnect
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11145598
Date of patent
October 12, 2021
Patent application number
20181228
Date Filed
December 28, 2018
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