Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mitsuaki Morimoto0
Eiichiro Oishi0
Date of Patent
October 12, 2021
0Patent Application Number
202003100
Date Filed
March 10, 2020
0Patent abstract
A semiconductor module unit includes a semiconductor module, and a control board that includes a driver circuit configured to output drive signals to the semiconductor module and controls the semiconductor module. The control board includes a main board, a sub board that is separated from the main board and on which the driver circuit is mounted, and a flexible board that has flexibility and electrically connects the main board and the sub board. The sub board includes a fitting part that is fitted in a fitted part of the semiconductor module. The semiconductor module is electrically connected to the driver circuit in a state where the fitting part is fitted in the fitted part.
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