US Patent 11153970 Apparatus with electrical components end mounted to printed circuit board

Disclosed herein is an apparatus that comprises a printed circuit board having a first major surface, a second major surface opposite the first major surface, and a minor surface perpendicular to the first major surface and the second major surface. The apparatus also comprises an electronic component that comprises a ball grid array, having spaced apart solder balls, on a mounting surface of the electronic component. The electronic component is mounted to the minor surface of the printed circuit board such that the mounting surface is parallel to the minor surface and perpendicular to the first major surface and the second major surface. The solder balls of the ball grid array are electrically connected to both the first major surface and the second major surface of the printed circuit board.