Patent attributes
A wiring board manufacturing method includes a sheet laminate forming step of impregnating a glass cloth with a synthetic resin to form a plurality of sheets and next stacking these sheets to form a sheet laminate having a first surface and a second surface, a core member forming step of stacking a release plate on the first surface of the sheet laminate, stacking an electrode plate on the second surface of the sheet laminate, next using a pressure plate to press the release plate, the sheet laminate, and the electrode plate in their stacked condition, thereby uniting them together to form a core member, and a grinding step of grinding the release plate of the core member in a condition where the electrode plate of the core member is held on a chuck table, thereby making a thickness of the core member uniform.
