US Patent 11156565 Method for inspecting semiconductor device
Patent 11156565 was granted and assigned to Hamamatsu Photonics on October, 2021 by the United States Patent and Trademark Office.
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Provided is a method for inspecting a semiconductor device which performs an inspection of a semiconductor device as an object to be inspected, including attaching an adhesive tape to a surface to be inspected of the semiconductor device, acquiring a first pattern image based on a light detected from a region including a surface of the surface to be inspected to which the adhesive tape is attached, inputting an electrical signal to the semiconductor device to which the adhesive tape is attached, acquiring a first heat generation image by detecting light according to heat radiation from the region including the surface to which the adhesive tape is attached in a state in which the electrical signal is input, and superimposing the first pattern image and the first heat generation image.
US Patent 11156565 Method for inspecting semiconductor device
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