US Patent 11162004 Electrically conductive adhesive and electrically conductive material
Patent 11162004 was granted and assigned to Nichia on November, 2021 by the United States Patent and Trademark Office.
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Patent abstract
Disclosed is an electrically conductive adhesive containing: (A) a polyether polymer having a backbone comprising a repeating unit of the formula: —R1—O— wherein R1 is a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive.
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Patent Inventor Names
Masafumi Kuramoto0
Teppei Kunimune0
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Official Website
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111620040
Date of Patent
November 2, 2021
0Patent Application Number
201709210
Date Filed
September 21, 2017
0Official Website
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US Patent 11162004 Electrically conductive adhesive and electrically conductive material
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11162004
Date of patent
November 2, 2021
Patent application number
20170921
Date Filed
September 21, 2017
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