Patent attributes
A wafer manufacturing method includes a wafer preparing step of preparing a wafer partitioned into a plurality of separate areas by a plurality of crossing streets, the wafer including a plurality of semiconductor devices respectively formed in the plural separate areas, a removing step of determining whether each semiconductor device formed in the wafer is an acceptable product or a defective product and removing a defective device area including the semiconductor device determined as the defective product, from the wafer, and a fitting step of fitting a device chip adapted to be fitted into a space formed by the removal of the defective device area from the wafer into the space of the wafer, the device chip including an acceptable semiconductor device having the same function as that of the semiconductor device determined as the defective product.
