US Patent 11164849 Chip assembly and chip

Embodiments provide a chip assembly and a chip. The chip assembly includes a substrate, a first chip and a second chip stacked on an upper surface of the substrate, and the first chip is arranged above the second chip. At edges of first sides of the first chip and the second chip there is provided with a first pad pair, and at edges of second sides of the first chip and the second chip there is provided with a second pad pair. The second pad pair is arranged between two adjacent functional units at an outermost side of the edge of the second side of the first chip or the second chip, and a lower edge of the second pad pair is not lower than lower edges of the two adjacent functional units.