Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsien-Pin Hu0
Wei-Cheng Wu0
Shin-Puu Jeng0
Chao-Hsiang Yang0
Chen-Hua Yu0
Shang-Yun Hou0
Date of Patent
November 9, 2021
0Patent Application Number
202005080
Date Filed
May 8, 2020
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A device includes a test pad on a chip. A first microbump has a first surface area that is less than a surface area of the test pad. A first conductive path couples the test pad to the first microbump. A second microbump has a second surface area that is less than the surface area of the test pad. A second conductive path couples the test pad to the second microbump.
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