US Patent 11174151 Integrated MEMS cavity seal
Patent 11174151 was granted and assigned to Invensense, Inc. on November, 2021 by the United States Patent and Trademark Office.
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Patent abstract
A microelectromechanical (MEMS) system may comprise multiple sensors within cavities of the MEMS system. The operation of different sensors requires different pressures within the respective cavities. A first cavity may be sealed at a first pressure. A through-hole may be etched into a cap layer of the MEMS system to introduce gas into a second cavity such that the cavity has a desired pressure. The cavity may then be sealed by a MEMS valve to maintain the desired pressure in the second cavity.
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Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111741510
Date of Patent
November 16, 2021
0Patent Application Number
166880510
Date Filed
November 19, 2019
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111741510
Date of Patent
November 16, 2021
0Patent Application Number
166880510
Date Filed
November 19, 2019
0Official Website
Patent Primary Examiner
Edits on 8 Jun, 2022
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Edits on 18 Nov, 2021
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US Patent 11174151 Integrated MEMS cavity seal
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11174151
Date of patent
November 16, 2021
Patent application number
16688051
Date Filed
November 19, 2019
Patent primary examiner
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