Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yuki Masuda0
Kimio Isobe0
Ryoji Okuda0
Yu Shoji0
Date of Patent
November 16, 2021
0Patent Application Number
157655960
Date Filed
September 21, 2016
0Patent Primary Examiner
Patent abstract
A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.
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