Patent 11175103 was granted and assigned to Toshiba Memory Corporation on November, 2021 by the United States Patent and Trademark Office.
Various implementations described herein relate to a heat sink having a base and a plurality of fins extending from the base. Each of the plurality of fins is spaced apart from other ones of the plurality of fins. The plurality of fins includes first fins and second fins. Each of the first fins is perpendicular to any of the second fins.