Patent attributes
A laser processing apparatus has a control unit including an inspection modified layer former detecting a provisional orientation flat of a bare wafer and applying a laser beam of a predetermined output power level to the bare wafer depending on the direction of the provisional orientation flat thereby to form a modified layer for detecting the crystal orientation closely to an outer edge of the bare wafer, and a crack detector detecting a crack extending from the modified layer toward a Y-axis and an exposed surface of the bare wafer, providing the modified layer extends along an X-axis in an image captured of the modified layer. If the crack detector detects no crack, the control unit determines the modified layer with no crack extending therefrom as extending parallel to the crystal orientation of the bare wafer.
