Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 16, 2021
Patent Application Number
16589529
Date Filed
October 1, 2019
Patent Primary Examiner
Patent abstract
Integrated chips and methods of forming the same include forming a lower conductive line over an underlying layer. An upper conductive via is formed over the lower conducting lines. An encapsulating layer is formed on the lower conductive line and the upper conductive via using a treatment process that converts an outermost layer of the lower conductive line and the upper conductive via into the encapsulating layer.
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