US Patent 11177213 Embedded small via anti-fuse device

An anti-fuse device having enhanced programming efficiency is provided. The anti-fuse device includes via contact structures that have different critical dimensions located between a first electrode and a second electrode. Notably, a first via contact structure having a first critical dimension is provided between a pair of second via contact structures having a second critical dimension that is greater than the first critical dimension. When a voltage is applied to the device, dielectric breakdown will occur first through the first via contact structure having the first critical dimension.