US Patent 11177220 Vertical and lateral interconnects between dies

Electronics devices, having vertical and lateral redistribution interconnects, are disclosed. An electronics device comprises an electronics component (e.g., die, substrate, integrated device, etc.), a die(s), and a separately formed redistribution connection layer electrically coupling the die(s) to the electronics component. The redistribution connection layer comprises dielectric layers on either side of at least one redistribution layer. The dielectric layers comprise openings that expose contact pads of the at least one redistribution layer for electrically coupling die(s) and components to each other via the redistribution connection layer. The redistribution connection layer is flexible and wrap/folded around side edges of die(s) to minimize vertical vias. Various devices and associated processes are provided.