US Patent 11177309 Image sensor with pad structure
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Patent abstract
The present disclosure relates to an image sensor with a pad structure formed during a front-end-of-line process. The pad structure can be formed prior to formation of back side deep trench isolation structures and metal grid structures. An opening is formed on a back side of the image sensor device to expose the embedded pad structure and to form electrical connections.
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Patent Inventor Names
Chun-Hao Chou0
Hsun-Ying Huang0
Kuo-Cheng Lee0
Yin-Chieh Huang0
Yun-Wei Cheng0
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Official Website
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Patent Citations Received
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Patent Jurisdiction
Patent Number
111773090
Date of Patent
November 16, 2021
0Patent Application Number
167414050
Date Filed
January 13, 2020
0Official Website
Patent Primary Examiner
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US Patent 11177309 Image sensor with pad structure
Infobox
Is a
Patent jurisdiction
Patent number
11177309
Date of patent
November 16, 2021
Patent application number
16741405
Date Filed
January 13, 2020
Patent primary examiner
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