Patent attributes
The present disclosure relates to semiconductor structures and, more particularly, to heterojunction bipolar transistors and methods of manufacture. The structure includes a collector region composed of semiconductor material; at least one marker layer over the collector region; a layer of doped semiconductor material which forms an extrinsic base and which is located above the at least one marker layer; a cavity formed in the layer of doped semiconductor material and extending at least to the at least one marker layer; an epitaxial intrinsic base layer of doped material located within the cavity; and an emitter material over the epitaxial intrinsic base layer and within an opening formed by sidewall spacer structures.