Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yung Feng Chang0
Sheng-Hsiung Wang0
Tung-Heng Hsieh0
Date of Patent
November 16, 2021
0Patent Application Number
167265400
Date Filed
December 24, 2019
0Patent Primary Examiner
Patent abstract
A method and structure for mitigating strain loss (e.g., in a FinFET channel) includes providing a semiconductor device having a substrate having a substrate fin portion, an active fin region formed over a first part of the substrate fin portion, a pickup region formed over a second part of the substrate fin portion, and an anchor formed over a third part of the substrate fin portion. In some embodiments, the substrate fin portion includes a first material, and the active fin region includes a second material different than the first material. In various examples, the anchor is disposed between and adjacent to each of the active fin region and the pickup region.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.