US Patent 11177850 Radio-frequency module
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Patent abstract
A radio-frequency module includes a substrate and a switch IC mounted on the substrate and including a common terminal and a plurality of selection terminals. The substrate includes ground electrodes disposed between the common terminal and the plurality of selection terminals in a plan view of the substrate.
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Patent Inventor Names
Masashi Hayakawa0
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Patent Number
111778500
Date of Patent
November 16, 2021
0Patent Application Number
168381070
Date Filed
April 2, 2020
0Official Website
Patent Primary Examiner
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US Patent 11177850 Radio-frequency module
Infobox
Is a
Patent jurisdiction
Patent number
11177850
Date of patent
November 16, 2021
Patent application number
16838107
Date Filed
April 2, 2020
Patent primary examiner
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