Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 16, 2021
0Patent Application Number
165177350
Date Filed
July 22, 2019
0Patent Primary Examiner
Patent abstract
A wiring substrate at which a metal wire is formed includes a substrate containing a resin as a main component and an organic substance having a hydroxyl group; and a metal plating layer constituting the metal wire. A formation portion of the metal wire at one surface of the substrate is rougher than a non-formation portion of the metal wire at the one surface of the substrate, and has the organic substance in a state of being embedded in the resin, and a catalyst. The wiring substrate with such a configuration can increase the adhesion of the metal wire to the substrate.
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