Patent attributes
According to one embodiment, a printed circuit board includes a base substrate, a first pad located on the base substrate, a second pad located on the base substrate alongside the first pad with respect to a first direction X with a gap therebetween and a solder resist covering the base substrate and including a cavity portion in a position overlapping the first pad and the second pad, the solder resist including a first protruding portion projecting in a second direction crossing the first direction and a second protruding portion projecting in the second direction on an opposite side to the first protruding portion, and the first protruding portion and the second protruding portion each overlap the gap, an end of the first pad on a gap side, and an end of the second pad on a gap side.
