Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 23, 2021
Patent Application Number
16319702
Date Filed
October 7, 2016
Patent Primary Examiner
Patent abstract
The present disclosure is drawn to microfluidic chips. The microfluidic chips can include an inflexible material having an elastic modulus of 0.1 gigapascals (GPa) to 450 GPa. A microfluidic channel can be formed within the inflexible material and can connect an inlet and an outlet. A working electrode can be associated with the microfluidic channel and can have a surface area of 1 μm2 to 60,000 μm2 within the microfluidic channel. A bubble support structure can also be formed within the microfluidic channel such that the working electrode is positioned to electrolytically generate a bubble that becomes associated with the bubble support structure.
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