US Patent 11180652 Thermoplastic resin composition and molded product using same

The present invention relates to a thermoplastic resin composition comprising (A) 60 wt % to 75 wt % of a polycarbonate resin, (B) 5 wt % to 20 wt % of a polybutylene terephthalate resin, (C) 2 wt % to 8 wt % of a polyethylene terephthalate resin, (D) 1 wt % to 5 wt % of a methyl methacrylate-styrene-acrylonitrile copolymer, (E) 3 wt % to 8 wt % of an acrylonitrile-butadiene-styrene graft copolymer including a rubbery polymer having an average particle diameter of 200 nm to 400 nm, and (F) 5 wt % to 10 wt % of an acrylonitrile-butadiene-styrene copolymer including a rubbery polymer having an average particle diameter of 400 nm to 600 nm, and to a molded product using the same.