US Patent 11180716 Cleaning formulation comprising a solvent additive

A cleaning formulation has from 10 to 99 wt % water, from 0.8 to 40 wt % surfactant, optionally other additives, and from 0.2 to 20 wt % of a solvent additive of formula (I):R1—O-(AO)n—C(═O)—R2  (I)where R1 is C3 to C12 alkyl, AO is an alkylene oxide group selected from an ethylene oxide group, a propylene oxide group and a butylene oxide group. At least one AO group in the solvent additive is an ethylene oxide group. The solvent additive has a water solubility of less than 1 wt % in deionised water at 20° C. and the surfactant enables the solvent additive to dissolve and/or disperse in the cleaning formulation. In a method of cleaning an oily or waxy soil from a hard surface, the solvent additive is applied to the hard surface and optionally rinsed with water. The solvent additive is used in a cleaning formulation to improve the percentage soil removal.