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US Patent 11181689 Low temperature solder in a photonic device

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
September 23, 2019
Date of Patent
November 23, 2021
Patent Application Number
16579330
Patent Citations Received
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US Patent 11892693 Photonic quantum computer assembly
0
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US Patent 11493714 Quantum computing die assembly with thru-silicon vias and connected logic circuit
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US Patent 11493713 Photonic quantum computer assembly having dies with specific contact configuration and matched CTE
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US Patent 11550108 Quantum computing die assembly with thru-silicon vias
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11181689
Patent Primary Examiner
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Rhonda S Peace

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