US Patent 11183396 Substrate processing method and substrate processing apparatus
Patent 11183396 was granted and assigned to Tokyo Electron on November, 2021 by the United States Patent and Trademark Office.
All edits
Edits on 12 Dec, 2023
Golden AI
Edits made to:
Article (+408 characters)
Article
Patent abstract
A substrate processing method according to the present disclosure includes heating and removing. The heating includes heating a substrate with a copper film that is formed thereon. The removing includes removing a copper film that is formed on a peripheral part of the substrate after the heating by supplying a processing liquid that contains an acidic chemical liquid to the peripheral part.
Edits on 22 Jul, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 26 Mar, 2023
Golden AI
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111833960
Date of Patent
November 23, 2021
0Patent Application Number
168417160
Date Filed
April 7, 2020
0Official Website
Patent Primary Examiner
Edits on 27 Sep, 2022
Golden AI
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111833960
Date of Patent
November 23, 2021
0Patent Application Number
168417160
Date Filed
April 7, 2020
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 25 Nov, 2021
Golden AI
Edits made to:
Infobox (+9 properties)
US Patent 11183396 Substrate processing method and substrate processing apparatus
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11183396
Date of patent
November 23, 2021
Patent application number
16841716
Date Filed
April 7, 2020
Patent primary examiner
Find more entities like US Patent 11183396 Substrate processing method and substrate processing apparatus
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
