US Patent 11183482 Shift control method in manufacture of semiconductor device

A shift control method in manufacture of semiconductor device includes at least the following step. An overlay offset of a first target of a semiconductor die and a second target of the semiconductor die is determined, where the second target is disposed on the first target. The semiconductor die is placed over a carrier, where placing the semiconductor die includes feeding back the overlay offset to result in a positional control of the semiconductor die. The semiconductor die is post processed to form a semiconductor device. Other shift control methods in manufacture of semiconductor device are also provided.