Patent 11186021 was granted and assigned to Synventive Molding Solutions on November, 2021 by the United States Patent and Trademark Office.
An injection molding system (10) and method of use where the system (10) is comprised of an injection molding system (10),a controller (16) for controlling pack or fill pressures of the injection fluid injected during the pack and fill phases,a recorder,the controller including instructions that controls drive of actuators (1a, 2a, 3a, 4a) to effect an increase or decrease in fill and pack pressures of the injection fluid.