US Patent 11186920 Apparatus capable of local polishing and plasma-electrolytic polishing system

An apparatus capable of local polishing and suitable for performing a plasma-electrolytic polishing process on an object is provided. The apparatus capable of local polishing includes a fixing seat, a motion mechanism, and a jet module connected to the motion mechanism and including an electrolyte communication port, a gas communication port, a power connection area, and a jet flow outlet. The jet flow outlet faces the fixing seat and is communicated with the electrolyte communication port and the gas communication port to be suitable for performing the plasma-electrolytic polishing process on the object fixed on the fixing seat. A plasma-electrolytic polishing system including an apparatus capable of local polishing is also provided.