Patent attributes
The present invention provides a planarization apparatus which planarizes a composition on a substrate by using a mold, the apparatus including a processing unit configured to, for each of a plurality of substrates, perform planarization processing for, by bringing a planar portion of the mold into contact with the composition on the substrate and making the planar portion conform to a surface shape of the substrate, planarizing the composition, and a driving unit configured to, whenever the planarization processing is performed a predetermined number of times, relatively drive the mold and a processing target substrate among the plurality of substrate so that a relative positional relationship between the processing target substrate and the planar portion changes.
