Patent attributes
A manufacturing method of a smart card. The manufacturing method comprises: respectively hollowing out a plurality of substrates to obtain a plurality of hollowed-out substrates (101); synthesizing the plurality of hollowed-out substrates to obtain a multilayer synthesized hollowed-out substrate (102); filling the synthesized hollowed-out substrate with an internal insert (103); and coating the synthesized hollowed-out substrate with adhesive to obtain the smart card (104). By adopting the technical solution that a multilayer synthesized hollowed-out substrate is obtained by synthesizing a plurality of hollowed-out substrates, and the synthesized hollowed-out substrate is filled with an internal insert, the production difficulty of the smart card with a function of human-computer interaction is reduced, and the production efficiency is increased.
